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Proceedings Paper

Optoelectronic integrated circuit's (OEIC's) application in WDM
Author(s): Manijeh Razeghi; Steven Slivken
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Paper Abstract

This paper reviews some of the key enabling technologies for present and future WDM communications systems. This review concentrates mainly on advances in material growth, lasers, modulators, and fast photodetectors as the basis modern communication systems. Emphasis is placed on integration of components, the need for reconfigurable switching elements, and mass production of a generic intelligent transceiver.

Paper Details

Date Published: 3 June 2002
PDF: 10 pages
Proc. SPIE 4652, Optoelectronic Interconnects, Integrated Circuits, and Packaging, (3 June 2002); doi: 10.1117/12.469578
Show Author Affiliations
Manijeh Razeghi, Northwestern Univ. (United States)
Steven Slivken, Northwestern Univ. (United States)

Published in SPIE Proceedings Vol. 4652:
Optoelectronic Interconnects, Integrated Circuits, and Packaging
Louay A. Eldada; Randy A. Heyler; John R. Rowlette; John R. Rowlette; Randy A. Heyler, Editor(s)

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