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Proceedings Paper

Telecommunication fiber OPA analysis, project, and characterization
Author(s): Lucia Marazzi; Paola Parolari; Igor Toscani; Mario Martinelli
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Paper Abstract

Extremely high is nowadays researchers' interest towards amplification techniques alternative to Erbium Doped Fiber Amplifiers (EDFA); driving force is the exploitation of new and larger fiber optic communication bandwidths. While EDFA gain relies on population inversion in an active material and thus amplification bandwidth is directly related to the doping ion energy levels, well known effects such as Raman and third order nonlinear susceptibility in optical fiber allow amplification not subject to this constraint. In optical parametric amplification, in particular, bandwidth shape and spectral collocation are determined by the choice of pump wavelength and power. Thus almost every spectral region can be reached provided that proper pump is available. We present a detailed analysis of optical parametric amplification in standard communication fiber, discussing different operation regime according to pump wavelength placement with respect to fiber zero dispersion wavelength. In particular attention is paid to the optical parametric amplifier gain bandwidth and saturation. We evidence that a key OPA project parameter is the relative phase between interacting waves, i.e., pump, signal and idler. This parameter not only allows comprehension of gain dynamics in the amplifier, but also can be controlled by engineering the nonlinear medium to improve OPA performances. Experimental verifications are also presented to validate the proposed analysis.

Paper Details

Date Published: 3 June 2002
PDF: 8 pages
Proc. SPIE 4652, Optoelectronic Interconnects, Integrated Circuits, and Packaging, (3 June 2002); doi: 10.1117/12.469567
Show Author Affiliations
Lucia Marazzi, CoreCom (Italy)
Paola Parolari, CoreCom (Italy)
Igor Toscani, CoreCom and Politecnico di Milano (Italy)
Mario Martinelli, CoreCom and Politecnico di Milano (Italy)

Published in SPIE Proceedings Vol. 4652:
Optoelectronic Interconnects, Integrated Circuits, and Packaging
Louay A. Eldada; Randy A. Heyler; John R. Rowlette; John R. Rowlette; Randy A. Heyler, Editor(s)

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