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Proceedings Paper

Use of glass solder in fixing an optical fiber in a laser package
Author(s): Roberto Galeotti; Mark Shaw; Maurizio Musio; Marcello Tienforti; Giacomo Coppo
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Paper Abstract

In order to couple the light emitted from a semiconductor laser into the core of an optical fiber, where the core and laser emitting are not matched, it is necessary to use a lens system. This lens system then focuses the divergent light into the fiber core; often this lens is fabricated on the end of the fiber. When the lens is on the end of the fiber, it must be fixed in place in front of the emitting laser using a method that will hold the fiber in position relative to the laser during the lifetime of the laser. This reliability requirement is particularly critical in the case of lasers with highly elliptical output beams. The tolerances for the displacement of the lensed fiber relative to the laser are extremely tight; a movement of less than 0.5 microns in the vertical direction can cause a drop in coupled power of greater than 10%. In this paper existing techniques of fixing the fiber relative to the laser are outlined and contrasted with an improved method using glass solder. The improved method is described with salient features such as the fixing of the fiber to a rigid support member and the laser welding process used to fix the rigid support member in front of the laser explained in detail. Other aspects of the laser design including thermal dissipation are also discussed in detail. Finite element analysis (FEA) was used extensively to demonstrate the capacity of the design. Device performance and reliability information is also presented, demonstrating the capability of this technique in the fixing of an optical fiber relative to a laser device.

Paper Details

Date Published: 3 June 2002
PDF: 12 pages
Proc. SPIE 4652, Optoelectronic Interconnects, Integrated Circuits, and Packaging, (3 June 2002); doi: 10.1117/12.469562
Show Author Affiliations
Roberto Galeotti, Corning O.T.I. SpA (Italy)
Mark Shaw, Corning O.T.I. SpA (Italy)
Maurizio Musio, Corning O.T.I. SpA (Italy)
Marcello Tienforti, Corning O.T.I. SpA (Italy)
Giacomo Coppo, Corning O.T.I. SpA (Italy)

Published in SPIE Proceedings Vol. 4652:
Optoelectronic Interconnects, Integrated Circuits, and Packaging
Louay A. Eldada; Randy A. Heyler; John R. Rowlette; John R. Rowlette; Randy A. Heyler, Editor(s)

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