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Proceedings Paper

Development of a micro hot embossing process for fabricating micro optical devices
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Paper Abstract

A micro hot embossing process has been developed for low cost and mass-production fabrications of optical switching components. After illustrating the architecture design and mold fabrication of a proposed optical switch, this paper describes the optimizations of parameters for hot embossing process to manufacture components of the optical switch. Polycarbonate has been used as the process material. The height of embossed mirrors, the thickness of actuating cantilever and the deformation of switch platforms have been measured precisely. The influence of process parameters has been investigated, and the optimized process parameters have been recommended with the process temperature and loading force being around 180°C and 1500Kg, respectively. The design guideline of nickel mold for easier release after embossing has also been recommended. The experimental results have demonstrated technological feasibility of micro hot embossing for low cost and mass-production of micro optical devices.

Paper Details

Date Published: 13 November 2002
PDF: 9 pages
Proc. SPIE 4936, Nano- and Microtechnology: Materials, Processes, Packaging, and Systems, (13 November 2002); doi: 10.1117/12.469430
Show Author Affiliations
Xue Chuan Shan, National Institute of Advanced Industrial Science and Technology (Japan)
Singapore Institute of Manufacturing Technology (Singapore)
Ryutaro Maeda, National Institute of Advanced Industrial Science and Technology (Japan)
Yoichi Murakoshi, National Institute of Advanced Industrial Science and Technology (Japan)


Published in SPIE Proceedings Vol. 4936:
Nano- and Microtechnology: Materials, Processes, Packaging, and Systems
Dinesh K. Sood; Ajay P. Malshe; Ryutaro Maeda, Editor(s)

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