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Proceedings Paper

New magnetic viscous damper with intelligent or smart fluid for the next generation
Author(s): Kunio Shimada; Hideto Kanno; Junji Ogawa; Shigemitsu Syuchi; Shinichi Kamiyama
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Paper Abstract

We propose a new viscous damper using magnetically responsive fluids, whose viscous damping factor can be changed by application of a magnetic field. The used fluids are intelligent or smart fluids; MF (magnetic fluid), MR fluid (magneto-rheological fluid), and MCF (magnetic compound fluid). The damper was developed in order to avoid the sedimentation of the fluid particles and to allow the viscous damping factor to be changed by using a fluctuating magnetic field as a semi-active damper. This solves the most important problem of the previous MR fluid damper, that is, sedimentation of the particles of the fluids. We experimentally investigated the dynamic characteristics of the newly developed damper having magnetically responsive fluids. The damper is a spring and mass single-degree-of-freedom system. We dealt with the vibration in a low frequency range, less than 10Hz, for the purpose of damping in architectural applications. A comparison of the differences of the damping effects of the three kinds of the fluids, MF, MR fluid, and MCF, showed that MCF has the largest damping effect. MCF is a new intelligent fluid developed by us for the purpose of having more apparent viscosity than MF and more stable particle dispersion than MR fluid. The experimental results can be explained by the cluster of particles aggregating in the form of a chain or necklace, as observed by microscope.

Paper Details

Date Published: 13 November 2002
PDF: 11 pages
Proc. SPIE 4936, Nano- and Microtechnology: Materials, Processes, Packaging, and Systems, (13 November 2002); doi: 10.1117/12.469423
Show Author Affiliations
Kunio Shimada, Akita Prefectural Univ. (Japan)
Hideto Kanno, Akita Prefectural Univ. (Japan)
Junji Ogawa, Akita Prefectural Univ. (Japan)
Shigemitsu Syuchi, Akita Prefectural Univ. (Japan)
Shinichi Kamiyama, Akita Prefectural Univ. (Japan)

Published in SPIE Proceedings Vol. 4936:
Nano- and Microtechnology: Materials, Processes, Packaging, and Systems
Dinesh K. Sood; Ajay P. Malshe; Ryutaro Maeda, Editor(s)

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