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Proceedings Paper

Speed it up to 10 Gb/s and flip chip it: VCSEL today
Author(s): Martin Grabherr; Dieter Wiedenmann; Roger King; Roland Jaeger; Burghard Schneider
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Paper Abstract

Accumulation of all advantageous properties VCSELs are famous for, like low power consumption, circular low divergent beam profile, high modulation bandwidth, and scalability of monolithic arrangements, results in two-dimensional (2D) VCSEL arrays that appear as key components to reach highest aggregate bandwidths of tomorrow's parallel optical transceivers. We report on 2D VCSEL arrays, substrate emitting although operating at 850 nm and prepared for flip-chip bonding, that are well suited for the customer's needs in terms of speed, power consumption, reliability and compact integration. Based on advanced technology, our arrays target the requirements of transceivers in the OC-192 VSR and 10 Gigabit Ethernet arena. In this paper we present the basic technology, static and dynamic device characteristics as well as reliability data for a 4x12 850 nm bottom-emitting VCSEL array. A13

Paper Details

Date Published: 4 June 2002
PDF: 8 pages
Proc. SPIE 4649, Vertical-Cavity Surface-Emitting Lasers VI, (4 June 2002); doi: 10.1117/12.469225
Show Author Affiliations
Martin Grabherr, ULM Photonics GmbH (Germany)
Dieter Wiedenmann, ULM Photonics GmbH (Germany)
Roger King, ULM Photonics GmbH (Germany)
Roland Jaeger, ULM Photonics GmbH (Germany)
Burghard Schneider, ULM Photonics GmbH (Germany)


Published in SPIE Proceedings Vol. 4649:
Vertical-Cavity Surface-Emitting Lasers VI
Chun Lei; Sean P. Kilcoyne, Editor(s)

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