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Proceedings Paper

Integrated holographic interferometry and moire interferometry for deformation measurement in electronic package
Author(s): Y. P. Yang; W. N. Wang; L. Liu
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Paper Abstract

In this study, a new experimental system, which integrated Holographic Interferometry (HI) with Moire Interferometry (MI), was developed for thermal deformation measurement in a ball grad array (BGA) assembly caused by power cycles. In the experiments MI was used for the in-plane measurement, and HI was used for the out-of-plane measurement, and furthermore, MI and HI were simultaneously operated. Therefore, it provided whole-field displacement information including the in-plane and the out-of- plane deformations with high sensitivity and resolution. The results showed that the in-plane expansion of the PCB was larger than that on the CBGA, and the PCB and the CBGA bended with different curvature. The corners of the CBGA were high strain concentration areas. The crucial techniques for thermal deformation measurement using the HI/HI system and typical experimental results for the CBGA-PCB assembly are described, and also, the reliability of solder balls of CBGA is discussed based on the measurements of the in-plane and the out-of-plane deformations.

Paper Details

Date Published: 29 May 2002
PDF: 4 pages
Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); doi: 10.1117/12.468847
Show Author Affiliations
Y. P. Yang, Capital Normal Univ. Beijing (China)
W. N. Wang, Capital Normal Univ. Beijing (China)
L. Liu, Capital Normal Univ. Beijing (China)


Published in SPIE Proceedings Vol. 4537:
Third International Conference on Experimental Mechanics

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