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Proceedings Paper

Investigation on fracture behavior of ferroelectric ceramics under combined electromechanical combined loading by using a moire interferometry technique
Author(s): Q. D. Bing; D. N. Fang
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Paper Abstract

This paper introduces how to in situ observe fracture behavior around crack tip in ferroelectric ceramics under combined electromechanical loading by use of a moire interferometry technique. The deformation field induced by electric field concentration near crack tip in three-points bending experiments was measured. By analyzing the moire interferometry images it is found that strain decreases faster than values predicted by the theoretical analysis as the distance away from the crack tip increases.

Paper Details

Date Published: 29 May 2002
PDF: 4 pages
Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); doi: 10.1117/12.468822
Show Author Affiliations
Q. D. Bing, Tsinghua Univ. (China)
D. N. Fang, Tsinghua Univ. (China)


Published in SPIE Proceedings Vol. 4537:
Third International Conference on Experimental Mechanics

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