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Proceedings Paper

Photoelastic investigation on thermal stresses in bonded structures
Author(s): Jiong-Shiun Hsu; Wei-Chung Wang
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Paper Abstract

The digital photoelastic and finite element methods were combined to clarify the interfacial stresses predicted by Suhir's theories. A special casting procedure was employed to obtain a true bi-material structures such that the theoretical assumptions can be satisfied. Through the analysis, some behaviors of the interfacial stresses were clarified. Besides, the distributions of the thermal stresses in the adherends calculated by Suhir and Timoshenko's theories were also discussed.

Paper Details

Date Published: 29 May 2002
PDF: 4 pages
Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); doi: 10.1117/12.468813
Show Author Affiliations
Jiong-Shiun Hsu, National Tsing Hua Univ. (China)
Wei-Chung Wang, National Tsing Hua Univ. (Taiwan)


Published in SPIE Proceedings Vol. 4537:
Third International Conference on Experimental Mechanics

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