Share Email Print
cover

Proceedings Paper

Measurement of warpage of electronic packaging after machining by phase-shifting shadow moire method
Author(s): Wei-Chung Wang; Yu-Wen Liu
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this paper, phase-shifting moire method was employed to investigate the machining effect on the warpage of electronic packagings undergone thermal cycles. Four types of machined slots were tested and compared with the unmachined one. It was found that they all give significant improvement on the warpage. However, the crossed type slot gives the largest reduction of warpage.

Paper Details

Date Published: 29 May 2002
PDF: 5 pages
Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); doi: 10.1117/12.468812
Show Author Affiliations
Wei-Chung Wang, National Tsing Hua Univ. (Taiwan)
Yu-Wen Liu, National Tsing Hua Univ. (Taiwan)


Published in SPIE Proceedings Vol. 4537:
Third International Conference on Experimental Mechanics

© SPIE. Terms of Use
Back to Top