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Proceedings Paper

Residual stress and fracture toughness in Pb(Zr0.58Ti0.42)O3 piezoelectric thin film
Author(s): Y. C. Zhou; X. J. Zheng
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Paper Abstract

Piezoelectric thin films with x equals 0.58 were deposited on Pt/Ti/Si by pulsed laser deposition (PLD). In the paper, the indentation fracture method was first used to determine the residual stress and fracture toughness of PZT thin film. In the determination of residual stress by indentation fracture method, two models including GLFW model and ZCF model were adopted. The fracture pattern diagram as a function of indentation load and thin film thickness was introduced. Radial and lateral cracks were observed in indentation with a Vickers diamond indenter. The experimental results show that the residual stress values measured by ZCF model were closer to the results measured by x- ray diffraction and the interface fracture toughness was much lower than the surface fracture toughness of PZT thin film.

Paper Details

Date Published: 29 May 2002
PDF: 4 pages
Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); doi: 10.1117/12.468802
Show Author Affiliations
Y. C. Zhou, Xiangtan Univ. (China)
X. J. Zheng, Xiangtan Univ. and Central South Univ. (China)


Published in SPIE Proceedings Vol. 4537:
Third International Conference on Experimental Mechanics

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