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Proceedings Paper

Thermal deformation of electronic package using scanning moire method with high-resolution microscopy
Author(s): Anand Krishna Asundi; Huimin Xie; Chai Gin Boay
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Paper Abstract

In this paper, the electron bema moire method and AFM scanning moire method are proposed to measure the thermal deformation in the BGA electronic packages. Electron beam moire and AFM moire fringe patterns in the BGA package are recorded. The shear strain at different solders in the package is measured. The two measurement techniques are discussed and analyzed in detail. The adaptability of these two methods is compared.

Paper Details

Date Published: 29 May 2002
PDF: 5 pages
Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); doi: 10.1117/12.468790
Show Author Affiliations
Anand Krishna Asundi, Nanyang Technological Univ. (Singapore)
Huimin Xie, Univ. at Albany (Singapore)
Chai Gin Boay, Nanyang Technological Univ. (Singapore)


Published in SPIE Proceedings Vol. 4537:
Third International Conference on Experimental Mechanics

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