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Proceedings Paper

Modeling, design, and fabrication of uncooled IR CMOS compatible thermoelectric sensors
Author(s): Eran Socher; Yehuda Sinai; Ofir Bochobza-Degani; Yael Nemirovsky
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Paper Abstract

We present a novel dry micromachining technique for the release of the thermally isolated spiral thermocouples, which achieve the highest thermal resistance for a rectangular pixel with a fixed size. The sensors are fabricated using mask-less post-processing of standard CMOS chips that contain CMOS readout electronics. Basic 1D thermal modeling of the sensors is presented and its limitations. Analysis of the performance of the sensors is derived from the modeling. Mechanical resonant frequencies for the structures are also shown. Design of such sensors in standard CMOS technology is reviewed, as well as results of fabricated devices. Fabricated devices include single elements and arrays up to 32*32 elements with pixel size and pitch of several tens of microns.

Paper Details

Date Published: 23 January 2003
PDF: 8 pages
Proc. SPIE 4820, Infrared Technology and Applications XXVIII, (23 January 2003); doi: 10.1117/12.468669
Show Author Affiliations
Eran Socher, Technion-Israel Institute of Technology (Israel)
Yehuda Sinai, Technion-Israel Institute of Technology (Israel)
Ofir Bochobza-Degani, Technion-Israel Institute of Technology (Israel)
Yael Nemirovsky, Technion-Israel Institute of Technology (Israel)


Published in SPIE Proceedings Vol. 4820:
Infrared Technology and Applications XXVIII
Bjorn F. Andresen; Gabor F. Fulop; Marija Strojnik, Editor(s)

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