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Proceedings Paper

Magnetron-sputtered TiNiCu shape memory alloy thin films with different Cu contents
Author(s): Yongqing Fu; Hejun Du
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Paper Abstract

TiNiCu films with different Cu contents were prepared by co-sputtering of TiNi and Cu targets using a magnetron sputtering system. Film microstructure, phase transformation behavior and crystallized structures were characterized. The substitution of Ni by Cu in TiNi based films resulted in a dramatic change in martensite structure and film orientation. With the increase of Cu content in the films, both the transformation temperatures and hysteresis decreases significantly from both differential scanning calorimeter (DSC) and X-ray diffraction (XRD) results. However, from both DSC and curvature measurement results, the specific heat and the maximum recovery stress generated during martensite transformation decreases.

Paper Details

Date Published: 13 November 2002
PDF: 7 pages
Proc. SPIE 4934, Smart Materials II, (13 November 2002); doi: 10.1117/12.468645
Show Author Affiliations
Yongqing Fu, Nanyang Technological Univ. (Singapore)
Hejun Du, Nanyang Technological Univ. (Singapore)

Published in SPIE Proceedings Vol. 4934:
Smart Materials II
Alan R. Wilson, Editor(s)

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