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Proceedings Paper

New heat exchanger concept for high-power diode laser systems
Author(s): Guido Bonati; Petra Hennig; Dirk Lorenzen; Ullrich Roellig; Juergen Schulz-Harder; K. Exel; Karsten Schmidt; A. Meier
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Paper Abstract

In order to achieve a thermally stable diode laser system based on high power diode laser bars, micro channel heat sinks are used to face the dissipated power with a density of 106 W/m2. Passively cooled diode lasers are either lower in power or facing higher junction temperatures. As a matter of principle the cooling with micro channel heat sinks requires a sealing between the heat sink itself and the system around. The leakage of this sealing, normally achieved by O-rings, can be reduced but never avoided. Sensible systems and extreme lifetime requirements, like in the telecom applications, already require passively cooled diode lasers with no water in the inner system boundaries. To achieve a minimized temperature shift in the junction, we developed a new copper based heat sink, spreading the dissipated heat in an optimised manner. Based on this, our further research shows that the higher temperature shift in a passive submount compared with active ones can be tolerated for a system, if the heat resistance to the external water heat exchanger is minimized. For applications either with or without the requirement of a thermo electric cooling element (TEC), we developed a technical solution for a heat exchanger, to keep water out of the inner system boundaries. The thermal resistance is low enough to run up to 12 passively cooled diode lasers on an regular ambient temperature and a minimum of junction temperature mismatch.

Paper Details

Date Published: 11 March 2003
PDF: 8 pages
Proc. SPIE 4947, Laser Diodes, Optoelectronic Devices, and Heterogenous Integration, (11 March 2003); doi: 10.1117/12.468633
Show Author Affiliations
Guido Bonati, Jenoptik Laserdiode GmbH (Germany)
Petra Hennig, Jenoptik Laserdiode GmbH (Germany)
Dirk Lorenzen, Jenoptik Laserdiode GmbH (Germany)
Ullrich Roellig, Jenoptik Laserdiode GmbH (Germany)
Juergen Schulz-Harder, Curamik Electronics GmbH (Germany)
K. Exel, Curamik Electronics GmbH (Germany)
Karsten Schmidt, Curamik Electronics GmbH (Germany)
A. Meier, Curamik Electronics GmbH (Germany)


Published in SPIE Proceedings Vol. 4947:
Laser Diodes, Optoelectronic Devices, and Heterogenous Integration

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