Share Email Print
cover

Proceedings Paper

3D vision sensor with multiple CCD cameras
Author(s): Seiji Hata; Daisuke Shima; Kan'ichi Kaida
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

For the mountedprinted circuit board inspection, the inspection system is required to detect the 3-D position of the components. To detect the 3-D positions of components,a 3-D vision sensor with multiple CCD cameras has been introduced. The system executes the stereo image processing to measure the 3-D position of he objects. For the electric components, the expected position on he PCB boards can be defined. So, the method of stereo image processing is simplified. Only preparing a measuremen line on every component is enough to detect its position. To perform the stereo image processing on the line, Dynamic Programming can be applied to perform the stereo matching between the locally deformed two images. Introducing the DP method to the stereo matching,the experimental system has been proved its precise 3-D position detection ability.

Paper Details

Date Published: 18 October 2002
PDF: 8 pages
Proc. SPIE 4902, Optomechatronic Systems III, (18 October 2002); doi: 10.1117/12.468381
Show Author Affiliations
Seiji Hata, Kagawa Univ. (Japan)
Daisuke Shima, Kagawa Univ. (Japan)
Kan'ichi Kaida, Matsushita Kotobuki Electronics Industries, Ltd. (Japan)


Published in SPIE Proceedings Vol. 4902:
Optomechatronic Systems III
Toru Yoshizawa, Editor(s)

© SPIE. Terms of Use
Back to Top