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Proceedings Paper

Optical surface analysis: a new technique for the inspection and metrology of optoelectronic films and wafers
Author(s): Laurie Bechtler; Vamsi Velidandla
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Paper Abstract

In response to demand for higher volumes and greater product capability, integrated optoelectronic device processing is rapidly increasing in complexity, benefiting from techniques developed for conventional silicon integrated circuit processing. The needs for high product yield and low manufacturing cost are also similar to the silicon wafer processing industry. This paper discusses the design and use of an automated inspection instrument called the Optical Surface Analyzer (OSA) to evaluate two critical production issues in optoelectronic device manufacturing: (1) film thickness uniformity, and (2) defectivity at various process steps. The OSA measurement instrument is better suited to photonics process development than most equipment developed for conventional silicon wafer processing in two important ways: it can handle both transparent and opaque substrates (unlike most inspection and metrology tools), and it is a full-wafer inspection method that captures defects and film variations over the entire substrate surface (unlike most film thickness measurement tools). Measurement examples will be provided in the paper for a variety of films and substrates used for optoelectronics manufacturing.

Paper Details

Date Published: 3 April 2003
PDF: 8 pages
Proc. SPIE 4944, Integrated Optical Devices: Fabrication and Testing, (3 April 2003); doi: 10.1117/12.468295
Show Author Affiliations
Laurie Bechtler, Candela Instruments (United States)
Vamsi Velidandla, Candela Instruments (United States)


Published in SPIE Proceedings Vol. 4944:
Integrated Optical Devices: Fabrication and Testing

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