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Proceedings Paper

Electronic speckle pattern interferometry for 3-D dynamic deformation analysis in industrial environments
Author(s): Gerd Guelker; Olaf Haack; Klaus D. Hinsch; Claudia Hoelscher; Juergen Kuls; Winfried Platen
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Paper Abstract

Electronic speckle pattern interferometry (ESPI) is applied to 3-D deformation mapping in practical problems from constructional engineering. The shrinking behavior and bonding ability of repair mortars applied in the restoration of historical stone buildings is monitored. Strategies are illustrated to process the huge amount of deformation data toward parameters characteristic of the relevant processes. Thus, ESPI is extended to routine applications in industrial inspection.

Paper Details

Date Published: 1 October 1991
PDF: 11 pages
Proc. SPIE 1500, Innovative Optics and Phase Conjugate Optics, (1 October 1991); doi: 10.1117/12.46821
Show Author Affiliations
Gerd Guelker, Carl-von-Ossietzky Univ. Oldenburg (Germany)
Olaf Haack, Carl-von-Ossietzky Univ. Oldenburg (Germany)
Klaus D. Hinsch, Carl-von-Ossietzky Univ. Oldenburg (Germany)
Claudia Hoelscher, Carl-von-Ossietzky Univ. Oldenburg (Germany)
Juergen Kuls, Carl-von-Ossietzky Univ. Oldenburg (Germany)
Winfried Platen, Carl-von-Ossietzky Univ. Oldenburg (Germany)


Published in SPIE Proceedings Vol. 1500:
Innovative Optics and Phase Conjugate Optics
Rolf-Juergen Ahlers; Theo T. Tschudi, Editor(s)

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