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Proceedings Paper

Optimizing etch uniformity for alternating aperture phase-shift masks on Etec Systems Tetra photomask etch system
Author(s): Nabila Lehachi Waheed; Cynthia J. Brooks
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Paper Abstract

A simple method for minimizing the glass etch non-uniformity in the Etec Systems' Tetra etch tool will be presented along with etch rate performance stability results. In this triple etch process, the final phase uniformity was improved from ± 5 ° to ± 1.3 ° phase shift at 248 nm without changing either processing chemistry or any other process parameters. The procedure used to obtain this improved uniformity as well as maps illustrating the depth distribution over the plate after each step will be given.

Paper Details

Date Published: 27 December 2002
PDF: 7 pages
Proc. SPIE 4889, 22nd Annual BACUS Symposium on Photomask Technology, (27 December 2002); doi: 10.1117/12.468202
Show Author Affiliations
Nabila Lehachi Waheed, Photronics Inc. (United States)
Cynthia J. Brooks, Etec Systems, Inc., And Applied Materials Co. (United States)

Published in SPIE Proceedings Vol. 4889:
22nd Annual BACUS Symposium on Photomask Technology
Brian J. Grenon; Kurt R. Kimmel, Editor(s)

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