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Proceedings Paper

Mask inspection challenges for 90- and 130-nm device technology nodes: inspection sensitivity and printability study using SEMI standard programmed defect masks
Author(s): Won D. Kim; Shinji Akima; Christopher M. Aquino; Charika Becker; Mark D. Eickhoff; Tsuyoshi Narita; Soo-Kim Quah; Peter M. Rohr; Robert Schlaffer; Junichi Tanzawa; Yoshiro Yamada
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Paper Abstract

As our chip producing industry rapidly ramps to mass production of the 130nm device technology node and wrapping up the final stages of 90nm node process technology development, the ability to inspect all types of 130nm node masks and early identification of shortcomings in 90nm node mask inspection are extremely important. In this paper, we share our experience of mask inspection for the 90nm and 130nm nodes, using the advanced TeraStar mask inspection system (KLA-Tencor) with the SEMI programmed defect standard masks, comprising three substrate types (binary, 248nm-KrF MoSi and 193nm-ArF MoSiON). Both Die-to-Die (D2D) and Die-to-Database (DDB) inspections were carried out and the results are presented with our assessments of benefits and shortcomings of those methods. To verify the resulting defects actually impact device functionality, we also carried out systematic printability experiments with our proprietary 130nm and 90nm nodes lithography processes. The wafer results were then compared with mask inspection results and mask measurement data to draw our final conclusions. In addition, we will also present inspection performance of the TeraStar system on our 130nm production masks and very challenging 90nm node (ArF EAPSM/AAPSM) development masks.

Paper Details

Date Published: 27 December 2002
PDF: 12 pages
Proc. SPIE 4889, 22nd Annual BACUS Symposium on Photomask Technology, (27 December 2002); doi: 10.1117/12.468084
Show Author Affiliations
Won D. Kim, Texas Instruments Inc. (United States)
Shinji Akima, Toppan Printing Co., Ltd. (Japan)
Christopher M. Aquino, KLA-Tencor Corp. (United States)
Charika Becker, KLA-Tencor Corp. (United States)
Mark D. Eickhoff, KLA-Tencor Corp. (United States)
Tsuyoshi Narita, Toppan Printing Co., Ltd. (Japan)
Soo-Kim Quah, Texas Instruments Inc. (United States)
Peter M. Rohr, Texas Instruments Inc. (United States)
Robert Schlaffer, KLA-Tencor Corp. (United States)
Junichi Tanzawa, Toppan Printing Co., Ltd. (Japan)
Yoshiro Yamada, Toppan Printing Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 4889:
22nd Annual BACUS Symposium on Photomask Technology
Brian J. Grenon; Kurt R. Kimmel, Editor(s)

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