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Proceedings Paper

Advanced 193 tri-tone EAPSM (9% to 18%) for 65-nm node
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Paper Abstract

Semiconductor manufacturers are increasingly focusing on contact and via layers as the most difficult lithography pattern. Focus and exposure latitude, MEF, as well as iso-dense bias are challenges for contact patterning. This situation is only expected to worsen for the 65nm device generation where the 2001 SIA roadmap update lists the contact size as 90-100nm in 2004-2005. Thus, new contact pattern techniques with novel manufacturability are required. One possible avenue to meet these stringent process control requirements is the use of tri-tone high transmission attenuated phase shifting masks (tri-tone AttPSM) for the 65nm generation. Multilayered SiN/TiN (9%-18%) EAPSM materials to manufacture advanced reticles were used in this investigation. Extensive study during the photomask processing (Front End and Back End) to access any issues related to the making of High %T tri-tone product types was performed. Finally, the 2 prototype reticles were evaluated on a 193nm scanner (0.75NA) with various illumination settings to generate imaging to support the 65nm node technology generation.

Paper Details

Date Published: 27 December 2002
PDF: 7 pages
Proc. SPIE 4889, 22nd Annual BACUS Symposium on Photomask Technology, (27 December 2002); doi: 10.1117/12.467783
Show Author Affiliations
Laurent Dieu, DuPont Photomasks, Inc. (United States)
Eric L. Fanucchi, DuPont Photomasks, Inc. (United States)
Greg P. Hughes, DuPont Photomasks, Inc. (United States)
John G. Maltabes, Motorola, Inc. (United States)
David L. Mellenthin, DuPont Photomasks, Inc. (United States)
Will Conley, Motorola, Inc. (United States)
Lloyd C. Litt, Motorola, Inc. (United States)
Kevin Lucas, Motorola, Inc. (United States)
Robert John Socha, ASML (United States)
Kurt E. Wampler, ASML (United States)
Arjan Verhappen, ASML (United States)
Jan-Pieter Kiujten, ASML (United States)


Published in SPIE Proceedings Vol. 4889:
22nd Annual BACUS Symposium on Photomask Technology
Brian J. Grenon; Kurt R. Kimmel, Editor(s)

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