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Proceedings Paper

Surface inspection of patterned wafer based on 2D wavelet transform
Author(s): Mingtao Zhao; Leon Dumoulin
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Paper Abstract

Dark-filed imaging and template techniques are employed for on-line scratch inspection of 8-inch patterned wafer. Uneven optical-filed illumination caused by the imperfection of the lighting source, big field of view and unwanted reflection of local tiny sloping areas of inspected die, will result in many fake scratches. Discrete 2D wavelet positive and reconstruction transforms are introduced to preserve only authentic scratches. Integrated with image subtraction operation and gradient sorting of each defect, obvious and faint scratches can be effectively recognized.

Paper Details

Date Published: 18 October 2002
PDF: 9 pages
Proc. SPIE 4902, Optomechatronic Systems III, (18 October 2002); doi: 10.1117/12.467632
Show Author Affiliations
Mingtao Zhao, Singapore Institute of Manufacturing Technology (Singapore)
Leon Dumoulin, Singapore Institute of Manufacturing Technology (Singapore)


Published in SPIE Proceedings Vol. 4902:
Optomechatronic Systems III
Toru Yoshizawa, Editor(s)

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