Share Email Print

Proceedings Paper

Compensation of long-range process effects on photomasks by design data correction
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

CD requirements for advanced photomasks are getting very demanding for the 100 nm-node and below; the ITRS roadmap requires CD uniformities below 10 nm for the most critical layers. To reach this goal, statistical as well as systematic CD contributions must be minimized. Here, we focus on the reduction of systematic CD variations across the masks that may be caused by process effects, e.g. dry etch loading. We address this topic by compensating such effects via design data correction analogous to proximity correction. Dry etch loading is modeled by gaussian convolution of pattern densities. Data correction is done geometrically by edge shifting. As the effect amplitude has an order of magnitude of 10 nm this can only be done on e-beam writers with small address grids to reduce big CD steps in the design data. We present modeling and correction results for special mask patterns with very strong pattern density variations showing that the compensation method is able to reduce CD uniformity by 50-70% depending on pattern details. The data correction itself is done with a new module developed especially to compensate long-range effects and fits nicely into the common data flow environment.

Paper Details

Date Published: 27 December 2002
PDF: 8 pages
Proc. SPIE 4889, 22nd Annual BACUS Symposium on Photomask Technology, (27 December 2002); doi: 10.1117/12.467572
Show Author Affiliations
Jens Schneider, Infineon Technologies AG (Germany)
Martin Bloecker, Infineon Technologies AG (Germany)
Gerd Ballhorn, Infineon Technologies AG (Germany)
Nikola Belic, PDF Solutions GmbH (Germany)
Hans Eisenmann, PDF Solutions GmbH (Germany)
Danny Keogan, Numerical Technologies, Inc. (United States)

Published in SPIE Proceedings Vol. 4889:
22nd Annual BACUS Symposium on Photomask Technology
Brian J. Grenon; Kurt R. Kimmel, Editor(s)

© SPIE. Terms of Use
Back to Top