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Proceedings Paper

STEAG HamaTech resist coater ASR5000: tool concept and process results
Author(s): Christian Krauss; Uwe U. Dietze; Fei Xu; Corinna Koepernik; Peter Dress; Peter Voehringer; Mathias Irmscher; Jakob Szekeresch
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Paper Abstract

Utilizing the balance of capillary forces and adhesion, a liquid material, e.g. photo resist, can be applied to the surface of a face down mounted substrate. STEAG HamaTech's Advanced single Substrate Resist coater, ASR5000, is combining patented capillary apply technology, and a patented face-down spin process, to enable fringe free uniform coatings on rectangular substrates. CAP COATing technology reduces resist consumption by a factor of at least 10 over conventional coating methods. Face down spin, provides highly uniform resist spread without risk of backside contamination. The principle equipment concept and capability is presented. Coating and bake performance is discussed for IP3600 and ZEP7000A. Coating uniformities, of smaller ±0.7% at a 4500Å thick IP3600 film and smaller ±0.4% at a 3000Å thick ZEP7000A resist film were achieved, respectively. The repeatability of the coating performance and the post coat bake process (PCB) are demonstrated.

Paper Details

Date Published: 27 December 2002
PDF: 10 pages
Proc. SPIE 4889, 22nd Annual BACUS Symposium on Photomask Technology, (27 December 2002); doi: 10.1117/12.467509
Show Author Affiliations
Christian Krauss, STEAG HamaTech AG (Germany)
Uwe U. Dietze, STEAG HamaTech USA, Inc. (United States)
Fei Xu, STEAG HamaTech USA, Inc. (United States)
Corinna Koepernik, Institut fuer Mikroelektronik Stuttgart (Germany)
Peter Dress, STEAG HamaTech AG (Germany)
Peter Voehringer, Institut fuer Mikroelektronik Stuttgart (Germany)
Mathias Irmscher, Institut fuer Mikroelektronik Stuttgart (Germany)
Jakob Szekeresch, STEAG HamaTech AG (Germany)

Published in SPIE Proceedings Vol. 4889:
22nd Annual BACUS Symposium on Photomask Technology
Brian J. Grenon; Kurt R. Kimmel, Editor(s)

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