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Proceedings Paper

Real-time temperature measurement on PCB:s, hybrids, and microchips
Author(s): Bo Wallin
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Paper Abstract

Over the last years thermographic methods have gained considerable ground for temperature measurement on electronic components like PCB:s, hybrids and microchips and quite a large number of articles and lectures have been published. Very little consideration has, however, been devoted to the fact, that the very uneven distribution of the emissivity over the PCB, hybrid or microchip to be measured implies that true temperature measurement cannot take place without special efforts in the form of hardware as well as software tools. The paper describes a method for true temperature measurement on PCB:s and microchips, with consideration to the varying emissivity over the field of view. It also describes a method for true temperature measurement on PCB:s in a rack or a box, where they are hidden for direct thermographic inspection. True temperature measurement on microscopic objects like transistors form another type of object, which demands special measurement hardware and extensive image processing to get the correct temperatures.

Paper Details

Date Published: 1 March 1991
PDF: 8 pages
Proc. SPIE 1467, Thermosense XIII, (1 March 1991); doi: 10.1117/12.46435
Show Author Affiliations
Bo Wallin, AGEMA Infrared Systems AB (Sweden)

Published in SPIE Proceedings Vol. 1467:
Thermosense XIII
George S. Baird, Editor(s)

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