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Proceedings Paper

Using IR thermography as a manufacturing tool to analyze and repair defects in printed circuit boards
Author(s): Daniel K. Fike
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Paper Abstract

The cost of printed circuit boards with multi-layered voltage planes has created the need for an easy to use tool that can detect, locate, verify and analyze hidden defects causing shorts. The use of a Thermal Image Analyzer (TIA) in conjunction with a hipot test and high voltage stress give manufacturing such a tool. This tool, controlled by a personal computer, directs the operator in the correct analysis procedures needed to safely detect, with thermal image analysis, the defective area of the product. The tool is capable of applying a high-voltage test and low- current stress to leakage defects. The tester can then apply constant power to the defect using low voltage (less than 24 VDC), enabling detection with the TIA. The entire operation is transparent to the manufacturing operator who when trained in the use of the TIA, can detect, isolate, categorize and repair internal and/or surface defects related to multi-layered printed circuit boards. This paper deals with the infrared detection and repair of defects in printed circuit boards as a manufacturing process.

Paper Details

Date Published: 1 March 1991
PDF: 4 pages
Proc. SPIE 1467, Thermosense XIII, (1 March 1991); doi: 10.1117/12.46431
Show Author Affiliations
Daniel K. Fike, IBM Corp. (United States)


Published in SPIE Proceedings Vol. 1467:
Thermosense XIII
George S. Baird, Editor(s)

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