Share Email Print
cover

Proceedings Paper

VUV-UV multiwavelength excitation process using F2 and KrF excimer lasers
Author(s): Koji Sugioka; Toshimitsu Akake; Kotaro Obata; Katsumi Midorikawa
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

VUV-UV multiwavelength excitation process for precision microfabrication of hard materials, in which simultaneous irradiation of the vacuum ultraviolet (VUV) laser beam with extremely small laser fluence and the ultraviolet (UV) laser beam leads to effective ablation, is reviewed. A collinear irradiation system of F2 and KrF excimer lasers has been developed for this process. This system achieves well- defined micropatterning of fused silica and GaN with little thermal influence and little debris deposition. Ablation mechanism is explained as absorption of KrF excimer laser by excited-states formed by F2 laser (excited-state absorption: ESA). In addition, this technique is applied for much more efficient refractive index modification of fused silica compared with single F2 laser irradiation, which is attributed to resonance photoionization-like process based on ESA. These processes are characterized by experiments carried out at various conditions such as laser fluence, irradiation timing of each laser beam, and pulse number.

Paper Details

Date Published: 30 April 2002
PDF: 10 pages
Proc. SPIE 4644, Seventh International Conference on Laser and Laser-Information Technologies, (30 April 2002); doi: 10.1117/12.464123
Show Author Affiliations
Koji Sugioka, RIKEN-The Institute of Physical and Chemical Research (Japan)
Toshimitsu Akake, RIKEN-The Institute of Physical and Chemical Research (Japan)
Kotaro Obata, RIKEN-The Institute of Physical and Chemical Research (Japan)
Katsumi Midorikawa, RIKEN-The Institute of Physical and Chemical Research (Japan)


Published in SPIE Proceedings Vol. 4644:
Seventh International Conference on Laser and Laser-Information Technologies

© SPIE. Terms of Use
Back to Top