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Proceedings Paper

Dry development and plasma durability of resists: melt viscosity and self-diffusion effects
Author(s): Patrick Jean Paniez; Olivier P. Joubert; Michel J. Pons; Jean Claude Oberlin; Andre P. Weill
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Paper Abstract

The degradation mechanisms of novolaks and high molecular weight polymers during plasma etching are investigated. The mechanical effects of ion bombardment are shown to generate surface degradation whereas the thermal effects allow the extension of the degradation to the bulk through self diffusion of chains. The various experiments clearly demonstrate the role of chain mobility and viscoelastic properties in the bulk degradation of polymers. If self diffusion, and this degradation, can easily occur with low molecular weight polymers, chain scission in high molecular weight polymers can lead to the same result. Degradation can be avoided by crosslinking polymer chains before or during plasma etching. Experiments with several commercial resist are given as an example.

Paper Details

Date Published: 1 June 1991
PDF: 9 pages
Proc. SPIE 1466, Advances in Resist Technology and Processing VIII, (1 June 1991); doi: 10.1117/12.46406
Show Author Affiliations
Patrick Jean Paniez, CNET-CNS (France)
Olivier P. Joubert, CNET-CNS (France)
Michel J. Pons, CNET-CNS (France)
Jean Claude Oberlin, CNET-CNS (France)
Andre P. Weill, CNET-CNS (France)

Published in SPIE Proceedings Vol. 1466:
Advances in Resist Technology and Processing VIII
Hiroshi Ito, Editor(s)

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