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Proceedings Paper

Surface imaging on the basis of phenolic resin: experiments and simulation
Author(s): Lothar Bauch; Ulrich A. Jagdhold; Helge H. Dreger; Joachim J. Bauer; Wolfgang W. Hoeppner; Hartmut H. Erzgraeber; Georg G. Mehliss
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Paper Abstract

Process simulation based on a two dimensional diffusion model for the reaction of the hexamethyldisilazan (HMDS) within the resist considering the crosslinks between photo active component (PAC) and resin and the following dry development is outlined. Results of silylation and etching simulation are discussed. Furthermore the influence of the resin composition and the conditions of silylation will be presented for an ORWO-resist.

Paper Details

Date Published: 1 June 1991
PDF: 10 pages
Proc. SPIE 1466, Advances in Resist Technology and Processing VIII, (1 June 1991); doi: 10.1117/12.46399
Show Author Affiliations
Lothar Bauch, Institut fuer Halbleiterphysik (Germany)
Ulrich A. Jagdhold, Institut fuer Halbleiterphysik (Germany)
Helge H. Dreger, Institut fuer Halbleiterphysik (Germany)
Joachim J. Bauer, Institut fuer Halbleiterphysik (Germany)
Wolfgang W. Hoeppner, Institut fuer Halbleiterphysik (Germany)
Hartmut H. Erzgraeber, Institut fuer Halbleiterphysik (Germany)
Georg G. Mehliss, Fotochemische Werke GmbH (Germany)


Published in SPIE Proceedings Vol. 1466:
Advances in Resist Technology and Processing VIII
Hiroshi Ito, Editor(s)

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