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Proceedings Paper

Technology and chemistry of high-temperature positive resist
Author(s): Medhat A. Toukhy; Thomas R. Sarubbi; David J. Brzozowy
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Paper Abstract

The strategy and chemistry employed to develop high resolution, high temperature positive resist systems (flow temperature >= 140 degree(s)C) based on novolak resin chemistry are reviewed and compared in this paper. Modest gains in resist thermal flow stability have been obtained using conventional cresol novolaks either by increasing molecular weight or decreasing the molecular weight dispersity by fractionation of the novolaks. Large gains in resist thermal flow stability have been obtained by adding a crosslinking agent to the resist. Similar gains have been obtained by redesigning the novolak structure by judicious choice of monomer to give high backbone rigidity. This rigidity imparts high thermal stability to the resists. Examples of the later two strategies are discussed in detail. The advantages and disadvantages of each approach, the trade-offs, and compromises in resist thermal flow stability, photospeed, and resolution are discussed in this review.

Paper Details

Date Published: 1 June 1991
PDF: 11 pages
Proc. SPIE 1466, Advances in Resist Technology and Processing VIII, (1 June 1991); doi: 10.1117/12.46398
Show Author Affiliations
Medhat A. Toukhy, OCG Microelectronic Materials, Inc. (United States)
Thomas R. Sarubbi, OCG Microelectronic Materials, Inc. (United States)
David J. Brzozowy, OCG Microelectronic Materials, Inc. (United States)


Published in SPIE Proceedings Vol. 1466:
Advances in Resist Technology and Processing VIII
Hiroshi Ito, Editor(s)

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