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Proceedings Paper

DQN photoresist with tetrahydroxydiphenylmethane as ballasting group in PAC
Author(s): Chao Huei Tzeng; Dhei-Jhai Lin; Song-Shiang Lin; Dong-Tsair Huang; Hwang-Kuen Lin
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Paper Abstract

A new photoactive compound (PAC) has been developed for a DQN (Diazonaphtho Quinone Novolak) resist system. The PAC is an esterification product of 1,2-naphthoquinone diazide-5-sulfonyl chloride and 2,3,4,4'-tetrahydroxydiphenylmethane (2344-THDM), which is a hydrogenation product of 2,3,4,4'-tetrahydroxybenzophenone (2344-THBP). The resist formulated from the cresol novolak and PAC exhibited fairly good light absorption and bleaching characteristics in the region of 300-45 nm. The resist performances such as resolution, photospeed, and exposure and defocus latitude in the g-line and i-line steppers are shown, respectively.

Paper Details

Date Published: 1 June 1991
PDF: 8 pages
Proc. SPIE 1466, Advances in Resist Technology and Processing VIII, (1 June 1991); doi: 10.1117/12.46395
Show Author Affiliations
Chao Huei Tzeng, Industrial Technology Research Institute (Taiwan)
Dhei-Jhai Lin, Industrial Technology Research Institute (Taiwan)
Song-Shiang Lin, Industrial Technology Research Institute (Taiwan)
Dong-Tsair Huang, Industrial Technology Research Institute (Taiwan)
Hwang-Kuen Lin, Industrial Technology Research Institute (Taiwan)

Published in SPIE Proceedings Vol. 1466:
Advances in Resist Technology and Processing VIII
Hiroshi Ito, Editor(s)

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