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Proceedings Paper

Progress in DUV resins
Author(s): Klaus Juergen Przybilla; Heinz Roeschert; Walter Spiess; Charlotte Eckes; Subhankar Chatterjee; Dinesh N. Khanna; Georg Pawlowski; Ralph R. Dammel
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Paper Abstract

Starting from general arguments on the relation of polymer structure, transparency at 248 nm, resin hydrophilicity and resist dissolution characteristics, binder systems for novel DUV resists are presented, and the results of their lithographic evaluation are discussed. Phenolic polymers studied include homo- and copolymers of 2-, 3-, and 4- hydroxystyrenes and of their alkyl substituted derivatives for three- component systems, as well as 2- and 4-hydroxyphenylmethacrylates for use in two-component t-BOC-type resists. As an alternative nonphenolic resin, the performance of a maleimide/styrene copolymer in a two- component system is discussed.

Paper Details

Date Published: 1 June 1991
PDF: 14 pages
Proc. SPIE 1466, Advances in Resist Technology and Processing VIII, (1 June 1991); doi: 10.1117/12.46368
Show Author Affiliations
Klaus Juergen Przybilla, Hoechst AG (Germany)
Heinz Roeschert, Hoechst AG (Germany)
Walter Spiess, Hoechst AG (Germany)
Charlotte Eckes, Hoechst AG (Germany)
Subhankar Chatterjee, Hoechst Celanese Corp. (Germany)
Dinesh N. Khanna, Hoechst Celanese Corp. (Germany)
Georg Pawlowski, Hoechst AG (Germany)
Ralph R. Dammel, Hoechst AG (Germany)

Published in SPIE Proceedings Vol. 1466:
Advances in Resist Technology and Processing VIII
Hiroshi Ito, Editor(s)

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