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Proceedings Paper

Exposure dose optimization for a positive resist containing polyfunctional photoactive compound
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Paper Abstract

Methods for optimizing the photolithographic process with respect to exposure dose are described. Various latent image gradients (the photoactive compound gradient, the dissolution rate gradient, and the log dissolution rate gradient) at the mask edge in the resist film are compared as a function of exposure dose. The relationship between the sequential photochemical decomposition of poly-diazonaphthoquinone photoactive compound, dissolution models and the dissolution selectivity parameter n is discussed. A methodology using full scale simulation to explore the effect of exposure sizing dose upon resist profile sidewall angle, exposure latitude, focus range, and linewidth variation with resist thickness (swing ratio) is described and compared to simpler models based upon the use of latent image gradients. Finally, the correspondence between simulation and experiment is explored.

Paper Details

Date Published: 1 June 1991
PDF: 15 pages
Proc. SPIE 1466, Advances in Resist Technology and Processing VIII, (1 June 1991); doi: 10.1117/12.46363
Show Author Affiliations
Peter Trefonas, Shipley Co., Inc. (United States)
Chris A. Mack, SEMATECH (United States)


Published in SPIE Proceedings Vol. 1466:
Advances in Resist Technology and Processing VIII
Hiroshi Ito, Editor(s)

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