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Proceedings Paper

PMMA microstructures deep-etch process
Author(s): A. B. Yu; Ai Qun Liu; Chunsheng Yang; Guifu Ding
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Paper Abstract

A PMMA-based reactive ion etching (RIE) process for the fabrication of high aspect ration microstructures is described in this paper. Although the resolution of this process is lower than that of the LIGA process, this process provides a simpler way to get higher height and high aspect ration microstructures. In the process, Ni material is selected as mask and patterned using photochemical etching. The self-bias, which is determined by different etching parameters such as etching power and gas pressure etc., is very important. By optimizing the etching parameters, vertical PMMA profile and 5:1 aspect ratio structures can be obtained. The micro-mask effect and high power etching damage are also demonstrated and discussed in this paper.

Paper Details

Date Published: 19 April 2002
PDF: 8 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462885
Show Author Affiliations
A. B. Yu, Nanyang Technological Univ. (Singapore)
Ai Qun Liu, Nanyang Technological Univ. (Singapore)
Chunsheng Yang, Shanghai Jiao Tong Univ. (China)
Guifu Ding, Shanghai Jiao Tong Univ. (China)


Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002

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