Share Email Print

Proceedings Paper

Measurement of the residual stresses of the handing structures used in MEMS
Author(s): Sebastien Rigo; Jean Michel Desmarres; Talal Masri; Jacques Alain Petit
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The purposes of failure analysis are to localize the failure site, to establish the type of failure and to understand the failure mechanism. Some MEMS, such as Analog Device's accelerometer ADXL501, are confronted with stiction problems. Either we get around the problem by creating designs, which are not subject to this type of failure, or we try to understand its mechanism. The residual stresses have an important role in the stiction because according to the configurations of the structures, they can stiffen beams and so oppose this failure, or amplify it by bending it towards underlying mechanical elements. That's why we carry an interest in the residual stresses to understand and counteract this type of failure. Besides, the residual stresses have also repercussion on properties such as fatigue, fracture, friction, which are at the origin of other types of failure. In this article, we attempt to set up a method to qualify and quantify the residual stresses in the different layers of the MUMP's process. The role of the residual stresses will be studied through the dimensions of the layers, their types, their coating temperatures to afford a feedback between the designers and the manufacturers. We will use a failure example in MEMS, the variable capacitance, to introduce the impact of the residual stress, on the nominal working of the mechanisms. To understand the failure of the capacitance, we chose to build test structures made of cantilevers to show the influence of the residual stresses of the different layers of multilayers. So the paper will be dedicated to the implementation of test structures and theoretical elements appropriate for revealing and determining the failure due to residual stresses.

Paper Details

Date Published: 19 April 2002
PDF: 10 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462875
Show Author Affiliations
Sebastien Rigo, MEMSCAP S.A. and Ctr. National d'Etudes Spatiales (France)
Jean Michel Desmarres, Ctr. National d'Etudes Spatiales (France)
Talal Masri, Ecole Nationale d'Ingenieurs de Tarbes (France)
Jacques Alain Petit, Ecole Nationale d'Ingenieurs de Tarbes (France)

Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002
Bernard Courtois; Jean Michel Karam; Karen W. Markus; Bernd Michel; Tamal Mukherjee; James A. Walker, Editor(s)

© SPIE. Terms of Use
Back to Top