Share Email Print

Proceedings Paper

Reliability of packaged MEMS in shock environment: crack and striction modeling
Author(s): Olivier Millet; Dominique Collard; Lionel Buchaillot
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

This paper aims at providing a detailed analysis of the consequences of shocking a packaged microstructure to a solid surface. Particularly it concerns the response of homogeneous, packaged clamped-clamped polysilicon microfabricated beams, which can be used in the case of MEMS switches. The theoretical analysis is composed of three parts; first, the micro-machined is considered as a single degree of freedom oscillator the motions of which is governed by an ordinary differential equation. It allows calculation of the deflection induced by the shock. Secondly, we determine the deflections inducing a stress of 1.5Gpa corresponding to the destruction of the polysilicon structures, for small and large deflections considerations. Finally, from the two first parts, pre-shock conditions (velocity and acceleration) are found to avoid stiction, impact and destruction of the packaged microstructures. It is shown that these pre-shock conditions depend on structural properties and damping. Moreover, a shock can generate decelerations ranging of millions of g's.

Paper Details

Date Published: 19 April 2002
PDF: 8 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462874
Show Author Affiliations
Olivier Millet, IRMN/CNRS (France)
Dominique Collard, CIRMM-IIS/CNRS/Univ. of Tokyo (France)
Lionel Buchaillot, IRMN/CNRS (Japan)

Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002

© SPIE. Terms of Use
Back to Top