Share Email Print

Proceedings Paper

Example of simultaneous alignment, packaging, and interconnection of MEMS stacks
Author(s): Harold S. Gross; Dinh Ton; M. Gmuer; David A. Crewe
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Packaging and electrical interconnection are an important part of the fabrication path of MEMS and MOEMS. This article shows one example for alignment, packaging and interconnection using anodic bonding in combination with vertical v-grooves for precise mechanical alignment. Stacks of twelve alternating layers of borosilicate glass and silicon have been fabricated with an alignment accuracy of better than +/21.5micrometers . Furthermore, a new anodic bonding method is presented that avoids any sodium compound formation at critical areas of a device.

Paper Details

Date Published: 19 April 2002
PDF: 9 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462871
Show Author Affiliations
Harold S. Gross, Optic Net, Inc. (United States)
Dinh Ton, Santur Corp. (United States)
M. Gmuer, Weidmann Plastics Technology A.G. (Switzerland)
David A. Crewe, Applied Materials, Inc. (United States)

Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002
Bernard Courtois; Jean Michel Karam; Karen W. Markus; Bernd Michel; Tamal Mukherjee; James A. Walker, Editor(s)

© SPIE. Terms of Use
Back to Top