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Proceedings Paper

Hot embossing of microstructures with integrated conduction paths for the production of lab-on-chip systems
Author(s): Mathias Heckele; Frank Anna
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Paper Abstract

Hot embossing allows directly integrating conduction paths made of gold in the channel structures required for applications in lab-on-chip systems. In experiments, ditch depths of more than 100 micrometers wide and 2-3 micrometers thick construction paths. It turned out to be of no relevance whether the inclination of the lateral walls was 45 degree(s) or 90 degree(s).

Paper Details

Date Published: 19 April 2002
PDF: 5 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462869
Show Author Affiliations
Mathias Heckele, Forschungszentrum Karlsruhe GmbH (Germany)
Frank Anna, Forschungszentrum Karlsruhe GmbH (Germany)


Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002

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