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Proceedings Paper

High-Q rf passives on organic substrates using a low-cost low-temperature laminate process
Author(s): Sidharth Dalmia; Seock Hee Lee; Swapan Bhattacharya; Farrokh Ayazi; Madhu Swaminathan
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Paper Abstract

This paper reports on a low-cost low-temperature (2. High-Q inductors and capacitors integrated on low-loss organic package substrates can find numerous RF and microwave SOP applications (such as VCO, IF/RF bandpass filters, LNA, etc., in which IC chips are flip-chip mounted on the package substrate. Integration of passives in organic substrates eliminates the excess cost of assembly, enables miniaturization by allowing for added functionality at the board level, and provides an attractive alternative to higher temperature processes such as ceramic and deposition technologies for high-Q passive implementation.

Paper Details

Date Published: 19 April 2002
PDF: 10 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462868
Show Author Affiliations
Sidharth Dalmia, Georgia Institute of Technology (United States)
Seock Hee Lee, Georgia Institute of Technology (United States)
Swapan Bhattacharya, Georgia Institute of Technology (United States)
Farrokh Ayazi, Georgia Institute of Technology (United States)
Madhu Swaminathan, Georgia Institute of Technology (United States)


Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002

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