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Proceedings Paper

Strength and long-term reliability testing of wafer-bonded MEMS
Author(s): Matthias Petzold; Dieter Katzer; M. Wiemer; Joerg Bagdahn
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Paper Abstract

Waferbonding techniques are frequently used for MEMS/MOEMS fabrication. In this paper, the potential application and methodical limitations of different strength testing approaches including tensile testing and double-cantilever- beam testing for wafer-bonded components are investigated. Special attention is given to the influence of the interfacial atomic bonding strength, the role of interface voids and notches caused by chemical or physical etching steps prior to bonding on the fracture limit. A particular aim of the paper is to discuss the potential of the Micro Chevron-Test for the assessment of the wafer bonding process with particular respect to the quality control during MEMS fabrication. In addition, the methods can also be applied to investigate the lifetime and fatigue properties of wafer- bonded samples exposed to constant or cyclic stresses.

Paper Details

Date Published: 19 April 2002
PDF: 11 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462863
Show Author Affiliations
Matthias Petzold, Fraunhofer-Institut fuer Werkstoffmechanik (Germany)
Dieter Katzer, Fraunhofer-Institut fuer Werkstoffmechanik (Germany)
M. Wiemer, Fraunhofer-Institut fuer Zuverlassigkeit und Mikrointegration (Germany)
Joerg Bagdahn, Fraunhofer-Institut fuer Werstoffmechankik and Johns Hopkins Univ. (United States)

Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002
Bernard Courtois; Jean Michel Karam; Karen W. Markus; Bernd Michel; Tamal Mukherjee; James A. Walker, Editor(s)

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