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Proceedings Paper

Handling of micro-optical components for microassembly
Author(s): Erik Beckert; Matthias Mohaupt; Gerd Harnisch; Ramona Eberhardt
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Paper Abstract

Technical challenges and directions for microoptical and optoelectronical packaging include the development of special handling tools for manual and automated assembly stations. These tools not only have to be precise, but also reliable in a mass production environment. The design process for handling devices therefore is a major issue and an approach to it will be presented. Several examples illustrate how the proposed design algorithm was used to solve assembly tasks like fiber handling and microlens- positioning.

Paper Details

Date Published: 19 April 2002
PDF: 13 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462853
Show Author Affiliations
Erik Beckert, Fraunhofer-Institut fuer Angewandte Optik und Feinmechanik (Germany)
Matthias Mohaupt, Fraunhofer-Institut fuer Angewandte Optik und Feinmechanik (Germany)
Gerd Harnisch, Fraunhofer-Institut fuer Angewandte Optik und Feinmechanik (Germany)
Ramona Eberhardt, Fraunhofer-Institut fuer Angewandte Optik und Feinmechanik (Germany)


Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002

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