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Proceedings Paper

Packaging solutions for MEMS/MOEMS using thin films as mechanical components
Author(s): P. Boyle; Richard R. A. Syms; David F. Moore
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Paper Abstract

Optoelectronic subsystems are becoming increasingly important to reduce the costs of assembly and packaging. The mechanical properties of vapor-deposited thin films can be used to advantage; for example three-micrometer thick silicon nitride microclips to hold single mode optic fibers in place in silicon V-shaped grooves. This paper describes the proposed use of pairs of thin film microcantilevers to precisely locate an optic component such as a filter or a mirror in an optical bench. In this configuration the precision of the lithographic process for the cantilevers determines the exact location of the component in the package, and to first order the etched shape in the substrate is unimportant. Simulation software based on variational principles has been developed to examine the behavior of structures undergoing large-scale elastic deflections. The design software consists of spreadsheet front end to enter parameters, and then Visual Basic (VBA) code and Frontline 'solver' software to run simulations. The fabrication process is described for 5 micrometers thick silicon carbide beams which are then tested by bending them using a surface profiler (such as a Dektak) to deflect the fifty micrometer wide silicon nitride cantilevers through large angles. The possible consequences for more efficient optoelectronic packaging are briefly assessed.

Paper Details

Date Published: 19 April 2002
PDF: 12 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462848
Show Author Affiliations
P. Boyle, Cambridge Univ. (United Kingdom)
Richard R. A. Syms, Imperial College of Science, Technology and Medicine (United Kingdom)
David F. Moore, Cambridge Univ. (Australia)

Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002

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