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Proceedings Paper

Polysilicon surface-micromachined spatial light modulator with novel electronic integration
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Paper Abstract

This paper presents a high-speed resolution phase-only microelectromechanical system (MEMS) spatial light modulator (SLM), integrated with driver electronics, using through- wafer vias and solder bump bonding. It employs a polysilicon thin film MEMS technology that is well suited to micromirror array fabrication and offers significant improvement in SLM speed in comparison to alternative modulator technologies. Vertical through-wafer interconnections offer scalability required to achieve 1M-pixel array size. The design, development, fabrication and characterization of a scalable driver integrated SLM is discussed. Pixel opto- electromechanical performance has been quantified experimentally on prototypes, and results are reported.

Paper Details

Date Published: 19 April 2002
PDF: 8 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462846
Show Author Affiliations
Clara E. Dimas, Boston Micromachines Corp. (United States)
Thomas G. Bifano, Boston Univ. (United States)
Paul A. Bierden, Boston Micromachines Corp. (United States)
Julie A. Perreault, Boston Univ. (United States)
Peter A. Krulevitch, Lawrence Livermore National Lab. (United States)
Ryan T. Roehnelt, MicroAssembly Technologies, Inc. (United States)
Steven Cornelissen, Boston Univ. (United States)

Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002

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