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Proceedings Paper

Integration of a network solver and a field solver for the mixed-level thermal simulation of MEMS problems
Author(s): Marta Rencz; Vladimir Szekely; Andras Poppe
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Paper Abstract

The paper presents an algorithm for the thermal simulation of MEMS problems for the cases when certain parts of the MEMS structure are given with their detailed structural description while others are given with the RC network compact models. The presented co-siumulation algorithm enables fast simulation in the frequency or in the time domain, and can be a very useful extension of any kind of field solvers. The thermal simulation of a hot-plate problem demonstrates the advantages and the simpli8city of the method.

Paper Details

Date Published: 19 April 2002
PDF: 8 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462840
Show Author Affiliations
Marta Rencz, MicReD Ltd. (Hungary)
Vladimir Szekely, Budapest Univ. of Technology and Economics (Hungary)
Andras Poppe, MicReD Ltd. and Budapest Univ. of Technology and Economics (Hungary)


Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002

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