Proceedings Paper
MEMS Max: a new full- 3D MEMS-featured rf-FEM analysis environment| Format | Member Price | Non-Member Price |
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Paper Abstract
Reducing design cycle time is a main concern of CAD tools. MEMS designers particularly suffer from a long and difficult design procedure in which different phases are involved: solid modeling, meshing and simulation. In this paper, we present, MEMS Max, the new MEMSCAP environment fully oriented towards RF-MEMS designers. It brings to the designer flexible, complete and easy-to-use RF MEMS-oriented tools. At the same time, it reduces efficiently the design cycle time.
Paper Details
Date Published: 19 April 2002
PDF: 8 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462837
Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002
Bernard Courtois; Jean Michel Karam; Karen W. Markus; Bernd Michel; Tamal Mukherjee; James A. Walker, Editor(s)
PDF: 8 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462837
Show Author Affiliations
Firas Mohamed, MEMSCAP S.A. (France)
Bachar Affour, MEMSCAP S.A. (France)
Stephane Despreaux, MEMSCAP S.A. (France)
Bachar Affour, MEMSCAP S.A. (France)
Stephane Despreaux, MEMSCAP S.A. (France)
B. Guillon, MEMSCAP S.A. (France)
Patrick Giroud, MEMSCAP S.A. (France)
Patrick Giroud, MEMSCAP S.A. (France)
Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002
Bernard Courtois; Jean Michel Karam; Karen W. Markus; Bernd Michel; Tamal Mukherjee; James A. Walker, Editor(s)
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