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Proceedings Paper

System-level modeling of microsystems using order reduction methods
Author(s): S. Reitz; J. Bastian; Joachim Haase; Peter Schneider; Peter Schwarz
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Paper Abstract

In the development of Microsystems, FEM simulators are used to investigate the behavior of system components with high accuracy. Generally, FEM simulations are time consuming. System-level models of all components are needed to allow a fast but sufficiently exact investigation of the system behavior to simulate entire microsystems. Typically, microsystems consist of nonelectrical components and electronic circuits. Providing models for electronic components and languages t describe the behavior of nonelectrical subsystems, simulators like Eldo, Saber, and VHDL-AMS simulators become more and more popular in the development of Microsystems. For simple structures such as mechanical beams, models of microsystem components can be derived from analytical descriptions. Another possibility to consider more complex structures is to use FEM descriptions to generate models for system simulation. Some FEM simulators like ANSYS allow access to the numerical values of the system matrices. They are established based on the description of geometry and material data. Usually, these system matrices are very large (10,000 up 10 100,000 system variables or more). For system simulation, models with about 10 up to 100 variables are often required. Therefore, methods for order reduction are applied to derive smaller system matrices. An improvement of an order reduction method based on a projection method is introduced in the paper. Using the reduced systems, behavioral models in languages like MAST, HDL-A OR VHDL- AMS can be generated automatically. The described method was applied successfully to simulate mechanical microsystem components on a system level.

Paper Details

Date Published: 19 April 2002
PDF: 9 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462833
Show Author Affiliations
S. Reitz, Fraunhofer-Institut fuer Integrierte Schaltungen (Germany)
J. Bastian, Fraunhofer-Institut fuer Integrierte Schaltungen (Germany)
Joachim Haase, Fraunhofer-Institut fuer Integrierte Schaltungen (Germany)
Peter Schneider, Fraunhofer-Institut fuer Integrierte Schaltungen (Germany)
Peter Schwarz, Fraunhofer-Institut fuer Integrierte Schaltungen (Germany)

Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002

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