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Proceedings Paper

Development of a new contact-type piezoresistive micro-shear-stress sensor
Author(s): M. C. Hsieh; Yean-Kuen Fang; M. S. Ju; Jyh-Jier Ho; S. F. Ting
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Paper Abstract

A prototype contact type micro piezoresistive shear-stress sensor that can be utilized to measure the shear stress between skin of stump and socket of Above-Knee (AK) prosthesis was designed, fabricated and tested. Micro-electro-mechanical system (MEMS) technology has been chosen for the design because of the low cost, small size and adaptability to this application. In this paper, the Finite Element Method (FEM) package ANSYS has been employed for the stress analysis of the micro shear-stress sensors. The sensors contain two X-ducers that will transform the stresses into an output voltage. In the developed sensor, a 3000X3000X3000 micrometers (superscript 3/ square membrane is formed by bulk micromachining of an n-type <100> monolithic silicon. The piezoresistive strain gauges were implanted with boron ions with a dose of 10(superscript 15/ atoms/cm(superscript 2/. Static characteristics of the shear sensor were determined through a series of calibration tests. The fabricated sensor exhibits a sensitivity of 0.13mV/mA-Mpa for a 1.4N full scales shear force range and the overall mean hysteresis error is than 3.5%. In addition, the results simulated by FEM are validated by comparison with experimental investigations.

Paper Details

Date Published: 19 April 2002
PDF: 11 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462822
Show Author Affiliations
M. C. Hsieh, National Cheng Kung Univ. (Taiwan)
Yean-Kuen Fang, National Cheng Kung Univ. (Taiwan)
M. S. Ju, National Cheng Kung Univ. (Taiwan)
Jyh-Jier Ho, Fortune Institute of Technology (Taiwan)
S. F. Ting, National Cheng Kung Univ. (Taiwan)


Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002

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