Share Email Print
cover

Proceedings Paper

Efforts in developing design and simulation tools for MEMS: DS/MEMS and CA/MEMS
Author(s): Sung Kie Youn; Byung Man Kwak; Jang-Hyuk Kwon; Su-Young Chang; Jae Sung Huh; Eugene Kim
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

In this work, multi-physics simulation software (CA/MEMS) and design-optimization software (DS/MEMS) tailored for MEMS devices are introduced. The CA/MEMS, which is a simulation engine for DS/MEMS, is a 3-D multi-physics analysis code utilizing various numerical methods such as FEM, BEM and FVM to efficiently model MEMS application problems. The current CA/MEMS includes analysis- modules for structural, thermal, electric, electromagnetic and fluidic fields and is capable of the analyses of various coupled- field problems for MEMS applications. DS/MEMS is design optimization engine for MEMS devices. With integrating CA/MEMS and pre/post processor into CAD environment, DS/MEMS is organized to work in parametric CAD platform. DS/MEMS consists of optimal design module and robust design module. The optimal design module provides users three methods nonlinear programming, Taguchi parameter design and the response surface method. The robust design module, which is specially developed for MEMS application, can be used to minimize the perturbation of performances of MEMS devices under uncertainties of MEMS devices, such as process tolerance and the change of operating environments. To verify the efficiency and accuracy of CA/MEMS and the practical usefulness of DS/MEMS, we have been comparing the simulated results of CA/MEMS with those of other commercial codes and experimental data of manufactured MEMS devices, and investigating the performances of the optimized designs through DS/MEMS.

Paper Details

Date Published: 19 April 2002
PDF: 10 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462821
Show Author Affiliations
Sung Kie Youn, Korea Advanced Institute of Science and Technology (South Korea)
Byung Man Kwak, Korea Advanced Institute of Science and Technology (South Korea)
Jang-Hyuk Kwon, Korea Advanced Institute of Science and Technology (South Korea)
Su-Young Chang, Korea Advanced Institute of Science and Technology (South Korea)
Jae Sung Huh, Korea Advanced Institute of Science and Technology (South Korea)
Eugene Kim, Korea Advanced Institute of Science and Technology (South Korea)


Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002

© SPIE. Terms of Use
Back to Top