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Proceedings Paper

Standardizing the microsystems technology description
Author(s): Karim Liateni; Gabriel Thomas; Christophe Hui Bon Hoa; David Bensaude
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Paper Abstract

The microsystems industry is promising a rapid and widespread growth for the coming years. The automotive, network, telecom and electronics industries take advantage of this technology by including it in their products; thus, getting better integration and high energetic performances. Microsystems related software and data exchange have inherited from the IC technology experience or standards, which appear not to fit the advanced level of conception currently needed by microsystems designers. A typical design flow to validate a microsystem device involves several software from disconnected areas like layout editors, FEM simulators, HDL modeling and simulation tools. However, and fabricated microsystem is obtained through execution of a layered process. Process characteristics will be used at each level of the design and analysis. Basically, the designer will have to customize each of his tools after the process. The project introduced here intends to unify the process description language and speed up the critical and tedious CAD customization task. We gather all the information related to the technology of a microsystem process in a single file. It is based on the XML standard format to receive worldwide attention. This format is called XML-MTD, standing for XML Microsystems Technology Description. Built around XML, it is an ASCII format which gives the ability to handle a comprehensive database for technology data. This format is open, given under general public license, but the aim is to manage the format withing a XML-MTD consortium of leader and well-established EDA companies and Foundries. In this way, it will take profit of their experience. For automated configuration of design and analysis tools regarding process-dependant information, we ship the Technology Manger software. Technology Manager links foundries with a large panel of standard EDA and FEA packages used by design teams relying on the Microsystems Technology Description in XML-MTD format.

Paper Details

Date Published: 19 April 2002
PDF: 8 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462808
Show Author Affiliations
Karim Liateni, MEMSCAP S.A. (France)
Gabriel Thomas, MEMSCAP S.A. (France)
Christophe Hui Bon Hoa, MEMSCAP S.A. (France)
David Bensaude, MEMSCAP S.A. (France)

Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002

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