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Proceedings Paper

In-situ sensors for product reliability monitoring
Author(s): Satchidananda Mishra; Michael Pecht; Douglas L. Goodman
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Paper Abstract

Some advantages of predicting reliability include providing advance warning signs of failure, and the reduction of life cycle costs by reducing inspection and unscheduled maintenance. However, predictions can be inaccurate if they do not account for the actual environments that the product is subjected to in its li8fe cycle. This paper describes an in-situ sensor (prognostic monitor) approach, which can be used to estimate the accumulated damage and the remaining life of semiconductor devices.

Paper Details

Date Published: 19 April 2002
PDF: 10 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462807
Show Author Affiliations
Satchidananda Mishra, Univ. of Maryland/College Park (United States)
Michael Pecht, Univ. of Maryland/College Park (United States)
Douglas L. Goodman, Ridgetop Group, Inc. (United States)

Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002
Bernard Courtois; Jean Michel Karam; Karen W. Markus; Bernd Michel; Tamal Mukherjee; James A. Walker, Editor(s)

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